Flex, a global manufacturing leader and innovator in data center infrastructure solutions, is partnering with LG Electronics (LG) to jointly develop integrated, modular cooling solutions that address the escalating thermal management challenges of AI-era data centers.
Advanced cooling technologies are required for more efficient heat dissipation in high-density data centers. The partnership brings together Flex's liquid cooling portfolio, proprietary power products, and IT infrastructure solutions with LG's high-performance air and liquid cooling modules, including CRAC, CRAH, chillers, coolant distribution units (CDUs), and full suite of thermal management and monitoring solutions. This gives data center operators the agility to customize solutions and scale with demand, the companies said.
"Through our collaboration with LG, Flex now offers customers a complete range of cooling solutions to tackle escalating heat challenges in the data center," said Michael Hartung, president and chief commercial officer, Flex. "Together, we'll deliver prefabricated, scalable data center infrastructure solutions that incorporate advanced liquid and air-cooling technologies to increase efficiency, simplify deployment, and speed time to revenue for our customers."
LG's advanced chiller systems efficiently produce cold water for data centers, working seamlessly with Flex and LG CDUs and secondary fluid networks (SFNs) to safeguard AI compute assets by keeping facility and IT cooling fluids separate. As a complete solution, these technologies deliver reliable temperature control, maximize energy efficiency, and ensure flexible, scalable thermal management and rapid deployment of high-density AI workloads, the companies said.
"We are advancing our competitiveness in the AI data center market by strategically partnering with leading global companies," said James Lee, president of the LG ES Company. "Our collaboration with Flex adds new momentum to our global expansion and enhances our ability to deliver unique value to clients worldwide."
Co-developed solutions will be available as part of the Flex AI infrastructure platform, a globally manufactured data center platform integrating power, cooling, compute, and services into modular designs.
Flex provides advanced manufacturing capabilities, innovative power and cooling products, and end-to-end lifecycle services that solve for data center power, heat, and scale challenges in the AI era.
For more information about this news, visit https://flex.com or www.lg.com.