Synopsys announced the official completion of its acquisition of Ansys, combining leaders in silicon design, IP and simulation, and analysis to enable customers to rapidly innovate AI-powered products.
The transaction was originally announced on January 16, 2024, positioning Synopsys to gain an expanded $31 billion of the total addressable market.
"Today marks a transformational milestone for Synopsys. For decades, Synopsys has been delivering breakthroughs in silicon design and IP that have fueled chip innovation," said president and CEO of Synopsys, Sassine Ghazi. "The increasing complexity of developing intelligent systems demands design solutions with a deeper integration of electronics and physics, enhanced by AI. With Ansys' leading system simulation and analysis solutions now part of Synopsys, we can maximize the capabilities of engineering teams broadly, igniting their innovation from silicon to systems."
Former Ansys president, CEO, and board member Ajei Gopal and former Ansys board member Ravi Vijayaraghavan are joining Synopsys' board of directors, effective immediately.
"For half a century, Ansys has enabled innovators across industries to push boundaries with the predictive power of simulation and analysis," said Gopal. "Our companies have a common culture, a successful longstanding partnership, and now a united mission to empower innovators to drive human advancement. I look forward to serving this mission as a member of the Synopsys board and expect a swift, successful integration."
Synopsys said it remains dedicated to helping engineers innovate, reduce time-to-market and costs, and improve product quality by delivering unprecedented insights into how their products will perform. And, united with Ansys, Synopsys can now deliver holistic system design solutions for customers in industries spanning semiconductors, high-tech, automotive, aerospace, industrial, and more.
Synopsys expects to deliver the first set of integrated capabilities in the first half of 2026 that fuse multiphysics across the full EDA stack, including for multi-die advanced packaging.
According to the company, the combined roadmap will also include integrated solutions to advance testing and virtualization of complex, intelligent systems for automotive and other industries.
For more information about this news, visit www.synopsys.com.